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MM908E622ACPEK
NXP USA Inc.RoHS 
RoHS compliant
RoHS compliantPackage 54-SSOP (0.295, 7.50mm Width) Exposed Pad
Category Embedded - Microcontrollers - Application Specific / Embedded - Microcontrollers - Application Specific
Description
Integrated Quad Half Bridge, Triple High Side and EC Glass Driver 54-Pin SOIC W EP
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Inventory: 7176
Minimum: 1
Total Price: USD $8.43
Unit Price: USD $8.43315
≥1 USD $8.43315
≥10 USD $6.9198
≥100 USD $6.7032
≥500 USD $6.48755
≥1000 USD $6.27095
Technical Details
Supply Chain
Factory Lead Time 16 Weeks
Physical
Mounting Type Surface Mount
Package / Case 54-SSOP (0.295, 7.50mm Width) Exposed Pad
Technical
Operating Temperature -40°C~85°C
Packaging Tube
Published 2003
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Terminal Finish Matte Tin (Sn)
Applications Automotive Mirror Control
HTS Code 8542.31.00.01
Technology CMOS
Voltage - Supply 9V~16V
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MM908E622
Interface SCI, SPI
Number of I/O 12
RAM Size 512 x 8
uPs/uCs/Peripheral ICs Type MICROCONTROLLER
Core Processor HC08
Program Memory Type FLASH (16kB)
Controller Series 908E
Compliance
RoHS Status ROHS3 Compliant
Alternative Model
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