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XCKU035-1FBVA676I

Xilinx Inc.
RoHS
RoHS RoHS compliant
Package 676-BBGA, FCBGA
Category Embedded - FPGAs (Field Programmable Gate Array) / Embedded - FPGAs (Field Programmable Gate Array)
Description Kintex? UltraScale? 676-BBGA FCBGA Tin/Silver/Copper (Sn/Ag/Cu) Surface Mount field programmable gate array 2.71mm 950mV 2.4MB -40C~100C TJ
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Inventory: 3341
Minimum: 1
Total Price: USD $188.84
Unit Price: USD $188.84345
≥1 USD $188.84345
≥10 USD $178.1542
≥100 USD $168.07
≥500 USD $158.5566
≥1000 USD $149.5817
≥3000 USD $141.11481

Technical Details

Supply Chain

Factory Lead Time 10 Weeks

Technical

Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2006
Series Kintex? UltraScale?
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 676
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Technology CMOS
Voltage - Supply 0.922V~0.979V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 0.95V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Outputs 312
Qualification Status Not Qualified
Operating Supply Voltage 950mV
Power Supplies 0.95V
Memory Size 2.4MB
Number of I/O 312
RAM Size 2.4MB
Memory Type RAM
Number of Logic Elements/Cells 444343
Total RAM Bits 19456000
Number of LABs/CLBs 25391
Speed Grade 1
Number of Registers 406256
Max Junction Temperature (Tj) 100°C

Physical

Contact Plating Copper, Silver, Tin
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 676-BBGA, FCBGA
Number of Pins 676

Dimensions

Height 2.71mm
Length 27mm
Width 27mm

Compliance

RoHS Status ROHS3 Compliant

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