Operating Temperature -55°C~150°C TJ
Packaging Cut Tape (CT)
Published 2011
JESD-609 Code e3
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 8
ECCN Code EAR99
Terminal Finish Matte Tin (Sn) - annealed
Additional Feature HIGH RELIABILITY
Subcategory FET General Purpose Power
Max Power Dissipation 1.17W
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number DMG4800LSD
Pin Count 8
Number of Elements 2
Element Configuration Dual
Operating Mode ENHANCEMENT MODE
Power Dissipation 1.17W
Turn On Delay Time 5.03 ns
FET Type 2 N-Channel (Dual)
Transistor Application SWITCHING
Rds On (Max) @ Id, Vgs 16m Ω @ 9A, 10V
Vgs(th) (Max) @ Id 1.6V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds 798pF @ 10V
Gate Charge (Qg) (Max) @ Vgs 8.56nC @ 5V
Rise Time 4.5 ns
Drain to Source Voltage (Vdss) 30V
Fall Time (Typ) 8.55 ns
Turn-Off Delay Time 26.33 ns
Continuous Drain Current (ID) 7.5A
Threshold Voltage 1.6V
Gate to Source Voltage (Vgs) 25V
Drain-source On Resistance-Max 0.016Ohm
Drain to Source Breakdown Voltage 30V
FET Technology METAL-OXIDE SEMICONDUCTOR
Max Junction Temperature (Tj) 150°C
FET Feature Logic Level Gate