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XCF32PFS48C
Xilinx Inc.RoHS
/
Package 48-TFBGA, CSPBGA
Category Memory - Configuration Proms for FPGAs / Memory - Configuration Proms for FPGAs
Description
XCF*P Tin/Lead (Sn63Pb37) EAR99 Tray ics fpga configuration 8mm 0.04mA 32Mb 1.8V
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Inventory: 785
Minimum: 1
Total Price: USD $200
Unit Price: USD $200
≥1 USD $200
≥10 USD $188.67925
≥100 USD $177.99929
≥500 USD $167.92386
≥1000 USD $158.41873
≥3000 USD $149.45163
Technical Details
Supply Chain
Factory Lead Time 13 Weeks
Dimensions
Height Seated (Max) 1.2mm
Length 9mm
Width 8mm
Technical
Operating Temperature -40°C~85°C
Packaging Tray
Published 1999
JESD-609 Code e0
Pbfree Code no
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 48
ECCN Code EAR99
Terminal Finish Tin/Lead (Sn63Pb37)
Additional Feature IT CAN ALSO OPERATES AT 2.5, 3.3 VOLT NOMINAL
HTS Code 8542.32.00.51
Subcategory Flash Memories
Technology CMOS
Voltage - Supply 1.65V~2V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1
Supply Voltage 1.8V
Terminal Pitch 0.8mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number XCF*P
Pin Count 48
Qualification Status Not Qualified
Operating Supply Voltage 1.8V
Supply Voltage-Max (Vsup) 2V
Supply Voltage-Min (Vsup) 1.65V
Programmable Type In System Programmable
Memory Size 32Mb
Operating Mode SYNCHRONOUS
Supply Current-Max 0.04mA
Organization 32MX1
Memory Width 1
Memory Density 33554432 bit
Parallel/Serial SERIAL
Memory IC Type CONFIGURATION MEMORY
Endurance 20000 Write/Erase Cycles
Data Retention Time-Min 20
Compliance
RoHS Status Non-RoHS Compliant
Lead Free Contains Lead
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