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XCF01SVO20C

Xilinx Inc.
RoHS
/
Package 20-TSSOP (0.173, 4.40mm Width)
Category Memory - Configuration Proms for FPGAs / Memory - Configuration Proms for FPGAs
Description XCF*S Tin/Lead (Sn85Pb15) EAR99 Tray ics fpga configuration 4.4mm 0.001A 1Mb 1.8/3.33V
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Inventory: 334
Minimum: 1
Total Price: USD $11.29
Unit Price: USD $11.29218
≥1 USD $11.29218
≥10 USD $10.653
≥100 USD $10.05
≥500 USD $9.48113
≥1000 USD $8.94446
≥3000 USD $8.43817

Technical Details

Supply Chain

Factory Lead Time 10 Weeks

Technical

Operating Temperature -40°C~85°C
Packaging Tray
Published 1999
JESD-609 Code e0
Pbfree Code no
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 20
ECCN Code EAR99
Terminal Finish Tin/Lead (Sn85Pb15)
Subcategory Flash Memories
Technology CMOS
Voltage - Supply 3V~3.6V
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 225
Number of Functions 1
Supply Voltage 3.3V
Terminal Pitch 0.65mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XCF*S
Pin Count 20
Operating Supply Voltage 3.3V
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 1.8/3.33V
Supply Voltage-Min (Vsup) 3V
Programmable Type In System Programmable
Memory Size 1Mb
Supply Current-Max 0.01mA
Organization 1MX1
Memory Width 1
Standby Current-Max 0.001A
Memory Density 1048576 bit
Parallel/Serial SERIAL
Memory IC Type CONFIGURATION MEMORY
Data Retention Time-Min 20

Physical

Mounting Type Surface Mount
Package / Case 20-TSSOP (0.173, 4.40mm Width)
Surface Mount YES
Number of Pins 20

Dimensions

Height Seated (Max) 1.19mm
Length 6.5024mm
Width 4.4mm

Compliance

Radiation Hardening No
RoHS Status Non-RoHS Compliant
Lead Free Contains Lead

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