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XC7Z045-1FFG900C
Xilinx Inc.RoHS 
RoHS compliant
RoHS compliantPackage 900-BBGA, FCBGA
Category Embedded - System On Chip (SoC) / Embedded - System On Chip (SoC)
Description
IC SOC CORTEX-A9 667MHZ 900FCBGA
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Inventory: 3570
Minimum: 1
Total Price: USD $331.79
Unit Price: USD $331.7913
≥1 USD $331.7913
Technical Details
Supply Chain
Factory Lead Time 10 Weeks
Physical
Contact Plating Copper, Silver, Tin
Package / Case 900-BBGA, FCBGA
Surface Mount YES
Number of Pins 900
Technical
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2009
Series Zynq?-7000
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 900
ECCN Code 3A991.D
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
HTS Code 8542.39.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 245
Supply Voltage 1V
Terminal Pitch 1mm
Frequency 667MHz
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC7Z045
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Max Supply Voltage 3.3V
Min Supply Voltage 1.2V
Number of I/O 130
RAM Size 256KB
Memory Type ROMless
Core Processor Dual ARM? Cortex?-A9 MPCore? with CoreSight?
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Data Bus Width 32b
Number of Logic Elements/Cells 190000
Core Architecture ARM
Boundary Scan YES
Speed Grade -1
RAM (words) 256000
Primary Attributes Kintex?-7 FPGA, 350K Logic Cells
Bus Compatibility CAN; ETHERNET; I2C; SPI; UART; USB
Dimensions
Height Seated (Max) 3.35mm
Length 31mm
Compliance
Radiation Hardening No
RoHS Status ROHS3 Compliant
Alternative Model
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