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XC7Z030-1FFG676I
Xilinx Inc.RoHS 
RoHS compliant
RoHS compliantPackage 676-BBGA, FCBGA
Category Embedded - System On Chip (SoC) / Embedded - System On Chip (SoC)
Description
IC SOC CORTEX-A9 667MHZ 676FCBGA
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Inventory: 2859
Minimum: 1
Total Price: USD $51.93
Unit Price: USD $51.93279
≥1 USD $51.93279
≥10 USD $48.9932
≥100 USD $46.22
≥500 USD $43.60377
≥1000 USD $41.13564
≥3000 USD $38.8072
Technical Details
Supply Chain
Factory Lead Time 10 Weeks
Physical
Contact Plating Copper, Silver, Tin
Package / Case 676-BBGA, FCBGA
Surface Mount YES
Number of Pins 676
Technical
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2009
Series Zynq?-7000
JESD-609 Code e1
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 676
ECCN Code 3A991.D
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.39.00.01
Subcategory Other uPs/uCs/Peripheral ICs
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 245
Supply Voltage 1V
Terminal Pitch 1mm
Frequency 667MHz
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC7Z030
Pin Count 676
Operating Supply Voltage 1V
Supply Voltage-Max (Vsup) 1.05V
Power Supplies 11.8V
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Number of I/O 130
RAM Size 256KB
Core Processor Dual ARM? Cortex?-A9 MPCore? with CoreSight?
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Data Bus Width 32b
Core Architecture ARM
Boundary Scan YES
Speed Grade -1
RAM (words) 256000
Primary Attributes Kintex?-7 FPGA, 125K Logic Cells
Bus Compatibility CAN; ETHERNET; I2C; SPI; UART; USB
UV Erasable N
Compliance
Radiation Hardening No
RoHS Status ROHS3 Compliant
Dimensions
Height Seated (Max) 3.24mm
Length 27mm
Alternative Model
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