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XCZU15EG-2FFVB1156I
Xilinx Inc.RoHS 
RoHS compliant
RoHS compliantPackage 1156-BBGA, FCBGA
Category Embedded - System On Chip (SoC) / Embedded - System On Chip (SoC)
Description
MCU FPGA Active ROHS3Compliant 2016 System On Chip (SOC) IC -40C~100C TJ 256KB 533MHz 600MHz 1.3GHz
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Inventory: 6284
Minimum: 1
Total Price: USD $550.79
Unit Price: USD $550.78872
≥1 USD $550.78872
≥10 USD $519.612
≥100 USD $490.2
≥500 USD $462.45283
≥1000 USD $436.27625
≥3000 USD $411.58137
Technical Details
Supply Chain
Factory Lead Time 11 Weeks
Physical
Package / Case 1156-BBGA, FCBGA
Technical
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2016
Series Zynq? UltraScale+? MPSoC EG
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
HTS Code 8542.31.00.01
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 328
Speed 533MHz, 600MHz, 1.3GHz
RAM Size 256KB
Core Processor Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq?UltraScale+? FPGA, 747K+ Logic Cells
Compliance
RoHS Status ROHS3 Compliant
Alternative Model
No data
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