Operating Temperature -40??C~100??C TJ
Packaging Tray
Published 2016
Series Zynq?? UltraScale+邃? MPSoC EG
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
HTS Code 8542.31.00.01
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 360
Speed 533MHz, 600MHz, 1.3GHz
RAM Size 256KB
Core Processor Quad ARM?? Cortex??-A53 MPCore邃? with CoreSight邃?, Dual ARM??Cortex邃?-R5 with CoreSight邃?, ARM Mali邃?-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq??UltraScale+邃? FPGA, 653K+ Logic Cells