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5ASXBB5D4F35I5N
IntelRoHS 
RoHS compliant
RoHS compliantPackage 1152-BBGA, FCBGA
Category Embedded - System On Chip (SoC) / Embedded - System On Chip (SoC)
Description
BALL BOTTOM MCU FPGA Active System On Chip (SOC) IC -40C~100C TJ 64KB 622MHz 1.1V
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Inventory: 7342
Minimum: 1
Total Price: USD $2754.46
Unit Price: USD $2754.46384
≥1 USD $2754.46384
≥10 USD $2663.89153
≥25 USD $2645.37391
≥50 USD $2626.98501
≥100 USD $2572.953
≥500 USD $2389
Technical Details
Supply Chain
Factory Lead Time 8 Weeks
Physical
Package / Case 1152-BBGA, FCBGA
Surface Mount YES
Technical
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series Arria V SX
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Terminal Finish TIN SILVER COPPER
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.1V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number 5ASXBB5
JESD-30 Code S-PBGA-B1152
Supply Voltage-Max (Vsup) 1.13V
Supply Voltage-Min (Vsup) 1.07V
Number of I/O MCU - 208, FPGA - 385
Speed 800MHz
RAM Size 64KB
Core Processor Dual ARM? Cortex?-A9 MPCore? with CoreSight?
Peripherals DMA, POR, WDT
Clock Frequency 622MHz
Connectivity EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 462K Logic Elements
Dimensions
Height Seated (Max) 2.7mm
Length 35mm
Width 35mm
Compliance
RoHS Status RoHS Compliant
Alternative Model
No data
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