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XCZU4CG-2FBVB900I
Xilinx Inc.RoHS 
RoHS compliant
RoHS compliantPackage 900-BBGA, FCBGA
Category Embedded - System On Chip (SoC) / Embedded - System On Chip (SoC)
Description
BALL BOTTOM MCU FPGA Active System On Chip (SOC) IC -40C~100C TJ 256KB 533MHz 1.3GHz 0.85V
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Inventory: 8725
Minimum: 1
Total Price: USD $141.63
Unit Price: USD $141.62978
≥1 USD $141.62978
≥10 USD $133.613
≥100 USD $126.05
≥500 USD $118.91509
≥1000 USD $112.18405
≥3000 USD $105.83401
Technical Details
Supply Chain
Factory Lead Time 11 Weeks
Physical
Package / Case 900-BBGA, FCBGA
Surface Mount YES
Technical
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2016
Series Zynq? UltraScale+? MPSoC CG
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 900
HTS Code 8542.31.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 0.85V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-PBGA-B900
Supply Voltage-Max (Vsup) 0.876V
Supply Voltage-Min (Vsup) 0.825V
Number of I/O 204
Speed 533MHz, 1.3GHz
RAM Size 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq?UltraScale+? FPGA, 192K+ Logic Cells
Compliance
RoHS Status ROHS3 Compliant
Alternative Model
No data
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