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XC7Z035-1FFG676I
Xilinx Inc.RoHS 
RoHS compliant
RoHS compliantPackage 676-BBGA, FCBGA
Category Embedded - System On Chip (SoC) / Embedded - System On Chip (SoC)
Description
IC SOC CORTEX-A9 667MHZ 676FCBGA
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Inventory: 4311
Minimum: 1
Total Price: USD $86.55
Unit Price: USD $86.55091
≥1 USD $86.55091
≥10 USD $81.6518
≥100 USD $77.03
≥500 USD $72.66981
≥1000 USD $68.55643
≥3000 USD $64.67587
Technical Details
Supply Chain
Factory Lead Time 10 Weeks
Physical
Contact Plating Copper, Silver, Tin
Mount Surface Mount
Package / Case 676-BBGA, FCBGA
Technical
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2010
Series Zynq?-7000
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 676
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1V
Frequency 667MHz
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B676
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Max Supply Voltage 1.05V
Min Supply Voltage 950mV
Number of I/O 130
RAM Size 256KB
Core Processor Dual ARM? Cortex?-A9 MPCore? with CoreSight?
Peripherals DMA
Propagation Delay 120 ps
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Core Architecture ARM
Boundary Scan YES
Speed Grade 1
RAM (words) 256000
Primary Attributes Kintex?-7 FPGA, 275K Logic Cells
Number of Registers 343800
Bus Compatibility CAN; ETHERNET; I2C; SPI; UART; USB
Dimensions
Height Seated (Max) 3.37mm
Length 27mm
Width 27mm
Compliance
RoHS Status ROHS3 Compliant
Alternative Model
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