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XC7Z035-1FFG900I
Xilinx Inc.RoHS 
RoHS compliant
RoHS compliantPackage 900-BBGA, FCBGA
Category Embedded - System On Chip (SoC) / Embedded - System On Chip (SoC)
Description
FPGA Zynq-7000 275000 Cells 28nm Technology 1V 900-Pin FCBGA Tray
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Pricing & Ordering
Inventory: 2010
Minimum: 1
Total Price: USD $98.18
Unit Price: USD $98.176035
≥1 USD $98.176035
≥10 USD $92.618901
≥100 USD $87.376321
≥500 USD $82.430485
≥1000 USD $77.764609
Technical Details
Physical
Package / Case 900-BBGA, FCBGA
Surface Mount YES
Number of Pins 900
Dimensions
Height Seated (Max) 3.35mm
Technical
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2010
Series Zynq?-7000
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 900
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 245
Supply Voltage 1V
Frequency 667MHz
Time@Peak Reflow Temperature-Max (s) 30
Operating Supply Voltage 1V
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Number of I/O 130
RAM Size 256KB
Core Processor Dual ARM? Cortex?-A9 MPCore? with CoreSight?
Peripherals DMA
Propagation Delay 130 ps
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Core Architecture ARM
Boundary Scan YES
Speed Grade 1
RAM (words) 256000
Primary Attributes Kintex?-7 FPGA, 275K Logic Cells
Number of Registers 343800
Bus Compatibility CAN; ETHERNET; I2C; SPI; UART; USB
Compliance
RoHS Status ROHS3 Compliant
Alternative Model
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