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XC7Z020-2CLG400E
Xilinx Inc.RoHS 
RoHS compliant
RoHS compliantPackage 400-LFBGA, CSPBGA
Category Embedded - System On Chip (SoC) / Embedded - System On Chip (SoC)
Description
BALL BOTTOM MCU FPGA Active System On Chip (SOC) IC 0C~100C TJ 256KB 766MHz 1V
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Inventory: 5758
Minimum: 1
Total Price: USD $87.91
Unit Price: USD $87.9111
≥1 USD $87.9111
≥10 USD $85.07535
≥100 USD $82.2396
≥500 USD $73.7314
Technical Details
Supply Chain
Factory Lead Time 10 Weeks
Dimensions
Height Seated (Max) 1.6mm
Length 17mm
Technical
Operating Temperature 0°C~100°C TJ
Packaging Tray
Published 2009
Series Zynq?-7000
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 400
ECCN Code EAR99
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.39.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 1V
Terminal Pitch 0.8mm
Frequency 766MHz
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC7Z020
Operating Supply Voltage 1V
Supply Voltage-Max (Vsup) 1.05V
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Number of I/O 130
RAM Size 256KB
Core Processor Dual ARM? Cortex?-A9 MPCore? with CoreSight?
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Data Bus Width 32b
Core Architecture ARM
Boundary Scan YES
Speed Grade -2
RAM (words) 256000
Primary Attributes Artix?-7 FPGA, 85K Logic Cells
Bus Compatibility CAN; ETHERNET; I2C; SPI; UART; USB
Compliance
Radiation Hardening No
RoHS Status ROHS3 Compliant
Physical
Contact Plating Copper, Silver, Tin
Package / Case 400-LFBGA, CSPBGA
Surface Mount YES
Number of Pins 400
Alternative Model
No data
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