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MPC8555EPXAPF

NXP USA Inc.
RoHS
/
Package 783-BBGA, FCBGA
Category Embedded - Microprocessors / Embedded - Microprocessors
Description FLOATING POINT MICROPROCESSOR RISC USB 2.0 (1) BALL IC Microprocessor 0C~105C TA 29mm 1.14V 166MHz
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Inventory: 2762
Minimum: 1
Total Price: USD $95.85
Unit Price: USD $95.850008
≥1 USD $95.850008
≥10 USD $90.424538
≥100 USD $85.306176
≥500 USD $80.477521
≥1000 USD $75.92219

Technical Details

Supply Chain

Factory Lead Time 12 Weeks

Physical

Package / Case 783-BBGA, FCBGA
Surface Mount YES

Technical

Operating Temperature 0°C~105°C TA
Packaging Tray
Published 2002
Series MPC85xx
JESD-609 Code e0
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 783
ECCN Code 5A002.A.1
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.31.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 245
Supply Voltage 1.2V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number MPC8555
JESD-30 Code S-PBGA-B783
Supply Voltage-Max (Vsup) 1.26V
Supply Voltage-Min (Vsup) 1.14V
Speed 833MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Core Processor PowerPC e500
Clock Frequency 166MHz
Bit Size 32
Address Bus Width 64
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 64
Format FLOATING POINT
Integrated Cache YES
Voltage - I/O 2.5V 3.3V
Ethernet 10/100/1000Mbps (2)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DDR, SDRAM
USB USB 2.0 (1)
Additional Interfaces DUART, I2C, PCI, SPI, TDM, UART
Co-Processors/DSP Communications; CPM, Security; SEC
Security Features Cryptography, Random Number Generator

Dimensions

Height Seated (Max) 3.75mm
Length 29mm

Compliance

RoHS Status Non-RoHS Compliant

Alternative Model

No data

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