Packaging Jar
Published 2015
Part Status Active
Moisture Sensitivity Level (MSL) Not Applicable
Type Solder Paste, Two Part Mix
Composition Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Shelf Life 24 Months
Storage/Refrigeration Temperature 37°F~77°F 3°C~25°C
Shelf Life Start Date of Manufacture
Form Jar, 0.53 oz (15g)
Process Lead Free
Melting Point 423°F~428°F 217°C~220°C
Flux Type No-Clean