Operating Temperature 0°C~95°C TJ
Packaging Tray
Published 2011
Series i.MX6SL
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 576
ECCN Code 5A992
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.31.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MCIMX6
JESD-30 Code S-PBGA-B
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.5V
Supply Voltage-Min (Vsup) 1.375V
Number of I/O 162
Speed 1.0GHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Core Processor ARM? Cortex?-A9
Supply Current-Max 1.1mA
Bit Size 32
Address Bus Width 16
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 32
Format FIXED POINT
Integrated Cache YES
RAM (words) 32000
Voltage - I/O 1.2V 1.8V 3.0V
Ethernet 10/100Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration Yes
RAM Controllers LPDDR2, LVDDR3, DDR3
USB USB 2.0 + PHY (3)
Additional Interfaces AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
Co-Processors/DSP Multimedia; NEON? SIMD
Bus Compatibility CAN; ETHERNET; IRDA; I2C; I2S; SPI; UART; USB
Security Features ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers Keypad, LCD